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TECHNICAL DATA AND KEY FIGURES FOR BUSBARS |
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Final formats
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1,350 x 600 mm |
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Number of layers
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depends on design |
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Board thickness
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up to 10mm, plated through
max. 25 mm, not plated through |
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Aspect ratio
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max. 1 : 12 |
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Material
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FR4, FR5
resistant to creep/tracking current (CTI 600) thermally conductive, environment-friendly, bromine-free |
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Surface
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immersion Ni/Au (others by agreement) |
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Copper thickness
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0.07 mm - 2.0 mm |
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Conductor
width/spacing
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depending on copper thickness |
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Voltage range
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up to approx. 8,000 Vrms
(depends on material and design) |
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Currents
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up to 2,000 A |
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Electrical tests
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Hi-Pot test
Partial discharge test |
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Pressfit assembly
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bushings for high current connections |